JPS58162040A - 双脚型電子部品の洗浄又は乾燥装置における固定装置 - Google Patents
双脚型電子部品の洗浄又は乾燥装置における固定装置Info
- Publication number
- JPS58162040A JPS58162040A JP57046122A JP4612282A JPS58162040A JP S58162040 A JPS58162040 A JP S58162040A JP 57046122 A JP57046122 A JP 57046122A JP 4612282 A JP4612282 A JP 4612282A JP S58162040 A JPS58162040 A JP S58162040A
- Authority
- JP
- Japan
- Prior art keywords
- shaft
- rod
- lever
- rail
- main shaft
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001035 drying Methods 0.000 title claims description 20
- 238000005406 washing Methods 0.000 title description 8
- 238000004140 cleaning Methods 0.000 claims description 18
- 238000000034 method Methods 0.000 description 10
- 230000008569 process Effects 0.000 description 8
- 238000005476 soldering Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 210000000078 claw Anatomy 0.000 description 2
- 241000218691 Cupressaceae Species 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Cleaning By Liquid Or Steam (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57046122A JPS58162040A (ja) | 1982-03-23 | 1982-03-23 | 双脚型電子部品の洗浄又は乾燥装置における固定装置 |
DE8383102678T DE3364325D1 (en) | 1982-03-23 | 1983-03-18 | A holding apparatus for use in cleaner or dryer for dual pin type electronic parts |
EP83102678A EP0090286B1 (en) | 1982-03-23 | 1983-03-18 | A holding apparatus for use in cleaner or dryer for dual pin type electronic parts |
US06/636,808 US4526185A (en) | 1982-03-23 | 1984-08-03 | Holding apparatus for use in cleaner or dryer for dual pin type electronic parts |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57046122A JPS58162040A (ja) | 1982-03-23 | 1982-03-23 | 双脚型電子部品の洗浄又は乾燥装置における固定装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS58162040A true JPS58162040A (ja) | 1983-09-26 |
JPS6316907B2 JPS6316907B2 (en]) | 1988-04-11 |
Family
ID=12738181
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP57046122A Granted JPS58162040A (ja) | 1982-03-23 | 1982-03-23 | 双脚型電子部品の洗浄又は乾燥装置における固定装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US4526185A (en]) |
EP (1) | EP0090286B1 (en]) |
JP (1) | JPS58162040A (en]) |
DE (1) | DE3364325D1 (en]) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61212048A (ja) * | 1985-03-18 | 1986-09-20 | Ideya:Kk | 電子部品の保持装置 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6136363U (ja) * | 1984-07-31 | 1986-03-06 | 株式会社 タムラ製作所 | 被はんだ付け物整列支持用の治具 |
JPH0352204U (en]) * | 1989-09-28 | 1991-05-21 | ||
US5531236A (en) * | 1994-06-01 | 1996-07-02 | Kempka; Steven N. | Directed flow fluid rinse trough |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US1884309A (en) * | 1927-11-21 | 1932-10-25 | Delcoremy Corp | Machine for surfacing the rubbing blocks of the circuit breaker levers of ignition timers |
US2156453A (en) * | 1936-07-06 | 1939-05-02 | Alfred E Hamilton | Grinding machine |
US2572364A (en) * | 1948-03-31 | 1951-10-23 | Ibm | Automatic grinding machine |
US2691254A (en) * | 1950-03-16 | 1954-10-12 | Robbins Edward Stanley | Tile sizing machine and method |
US2972997A (en) * | 1956-04-09 | 1961-02-28 | Libbey Owens Ford Glass Co | Apparatus for cleaning surfaces |
US3583363A (en) * | 1969-03-05 | 1971-06-08 | Air Reduction | Substrate support apparatus |
US3749058A (en) * | 1971-07-26 | 1973-07-31 | Ion Equipment Corp | Rotary substrate holder assembly |
DE3028536C2 (de) * | 1980-07-28 | 1983-01-05 | Siemens AG, 1000 Berlin und 8000 München | Vorrichtung zur Halterung von kreisförmigen Substratscheiben und ihre Verwendung |
-
1982
- 1982-03-23 JP JP57046122A patent/JPS58162040A/ja active Granted
-
1983
- 1983-03-18 DE DE8383102678T patent/DE3364325D1/de not_active Expired
- 1983-03-18 EP EP83102678A patent/EP0090286B1/en not_active Expired
-
1984
- 1984-08-03 US US06/636,808 patent/US4526185A/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61212048A (ja) * | 1985-03-18 | 1986-09-20 | Ideya:Kk | 電子部品の保持装置 |
Also Published As
Publication number | Publication date |
---|---|
EP0090286A1 (en) | 1983-10-05 |
DE3364325D1 (en) | 1986-08-07 |
JPS6316907B2 (en]) | 1988-04-11 |
EP0090286B1 (en) | 1986-07-02 |
US4526185A (en) | 1985-07-02 |
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